Numerical investigation of heat transfer enhancement and fluid flow characteristics in a microchannel heat sink with different wall/design configurations of protrusions/dimples-Reference-Cited by-同舟云学术

Numerical investigation of heat transfer enhancement and fluid flow characteristics in a microchannel heat sink with different wall/design configurations of protrusions/dimples

Published:2019-07-25 Issue:1 Volume:56 Page:239-255
ISSN:0947-7411
Container-title:Heat and Mass Transfer
language:en
Short-container-title:Heat Mass Transfer

Author:

Rehman Muhammad Mohib Ur,Cheema Taqi Ahmad^ORCID,Ahmad Faraz,Abbas Ahmad,Malik Muhammad Sohail

Publisher

Springer Science and Business Media LLC

Subject

Fluid Flow and Transfer Processes,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s00231-019-02697-9.pdf

Reference32 articles.

1. Xu M, Lu H, Gong L, Chai JC, Duan X (2016) Parametric numerical study of the flow and heat transfer in microchannel with dimples. Int Commun Heat Mass Transf 76:348–357

2. Khan AA, Kim S-M, Kim K-Y (2016) Performance analysis of a microchannel heat sink with various rib configurations. J Thermophys Heat Transf 30(4):782–790

3. Wei X, Joshi Y, Patterson MK (2007) Experimental and numerical study of a stacked microchannel heat sink for liquid cooling of microelectronic devices. J Heat Transf 129(10):1432

4. Tuckerman DB, Pease RFW (1981) High-performance heat sinking for VLSI. IEEE Electron Device Lett 2(5):126–129

5. Lan J, Xie Y, Zhang D (2012) Flow and heat transfer in microchannels with dimples and protrusions. J Heat Transf 134(2):021901

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