Analysis and experimental validation of a pumped two-phase loop for multi-component electronics cooling
Author:
Publisher
Springer Science and Business Media LLC
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Link
https://link.springer.com/content/pdf/10.1007/s00231-023-03440-1.pdf
Reference44 articles.
1. Moore GE (1965) Cramming more components onto integrated circuits. McGraw-Hill New York
2. Zhang Z, Wang X, Yan Y (2021) A review of the state-of-the-art in electronic cooling. E-Prime Adv Electr Eng Electron Energy 1:100009. https://doi.org/10.1016/j.prime.2021.100009
3. Wang CC (2017) A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress. Inventions 2(1). https://doi.org/10.3390/inventions2010005
4. McGlen RJ, Jachuck R, Lin S (2004) Integrated thermal management techniques for high power electronic devices. Appl Therm Eng 24(8):1143–1156. https://doi.org/10.1016/j.applthermaleng.2003.12.029
5. Hoang CH et al (2021) A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices. IEEE Trans Compon Packag Manuf Technol 11(10):1565–1582. https://doi.org/10.1109/TCPMT.2021.3117572
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