Author:
Kim Bong-Hwan,Shin Hoon-Kyun,Park Jin Young,Chang Sang-Mok
Funder
Ministry of Land, Infrastructure and Transport of Korean government
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. M. Mori, K. Oyama, Y. Kohno, J. Sakano, J. Uruno, K. Ishizaka, D. Kawase, A trench-gate high-conductivity IGBT (HiGT) with short-circuit capability. IEEE Trans. Electron Devices 54(8), 2011–2016 (2007)
2. E. Suekawa, Y. Tomomatsu, T. Enjoji, H. Kondoh, M. Takeda, T. Yamada, High voltage IGBT (HV-IGBT) having p+/p− collector region, in Proceedings of ISPSD’9 (1998), pp. 249–252
3. M. Mori, K. Oyama, T. Arai, J. Sakano, Y. Nishimura, K. Masuda, K. Saito, Y. Uchino, H. Homma, A planar-gate high-conductivity IGBT (HiGT) with hole-barrier layer. IEEE Trans. Electron Devices 54(6), 1515–1520 (2007)
4. J. Won, J.G. Koo, T. Rhee, H.-S. Oh, J.H. Lee, Reverse-conducting IGBT using MEMS technology on the wafer back side. ETRI J. 35(4), 603–609 (2013)
5. N. Patil, D. Das, K. Goebel, M. Pecht, Failure precursors for insulated gate bipolar transistors, in Proceedings of the 1st International Conference on Prognostics and Health Management (2008)