Stress relaxation of wood during elevating and lowering processes of temperature and the set after relaxation II: consideration of the mechanism and simulation of stress relaxation behavior using a viscoelastic model-Reference-Cited by-同舟云学术

Stress relaxation of wood during elevating and lowering processes of temperature and the set after relaxation II: consideration of the mechanism and simulation of stress relaxation behavior using a viscoelastic model

Published:2002-04 Issue:2 Volume:48 Page:119-125
ISSN:1435-0211
Container-title:Journal of Wood Science
language:en
Short-container-title:J Wood Sci

Author:

Iida Ikuho,Kudo Michiyasu,Onizuka Jyunji,Ishimaru Yutaka,Furuta Yuzo

Publisher

Springer Science and Business Media LLC

Subject

Biomaterials

Link

http://link.springer.com/content/pdf/10.1007/BF00767288.pdf

Reference10 articles.

1. Iida I, Murase K, Ishimaru Y (2002) Stress relaxation of wood in the elevating and lowering processes of temperature and the set after relaxation. J Wood Sci 48:8–13

2. Kitahara K, Yukawa K (1964) The influence of the change of temperature on creep in bending. Mokuzai Gakkaishi 10:169–175

3. Arima T (1972) Creep in process of temperature changes. I. Creep in process of constant elevated and decreased temperature. Mokuzai Gakkaishi 18:349–353

4. Shniewind A (1966) On the influence of moisture content changes on the creep of beech wood perpendicular to the grain including the effects of temperature and temperature changes. Holz Roh Werkstoff 24:87–98

5. Ishimaru Y, Yamada Y, Iida I, Urakami H (1996) Dynamic viscoelastiy properties of wood in various stages of swelling. Mokuzai Gakkaishi 42:205–257

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