Stress relaxation of wood during the elevating and lowering processes of temperature and the set after relaxation-Reference-Cited by-同舟云学术

Stress relaxation of wood during the elevating and lowering processes of temperature and the set after relaxation

Published:2002-02 Issue:1 Volume:48 Page:8-13
ISSN:1435-0211
Container-title:Journal of Wood Science
language:en
Short-container-title:J Wood Sci

Author:

Iida Ikuho,Murase Koichi,Ishimaru Yutaka

Publisher

Springer Science and Business Media LLC

Subject

Biomaterials

Link

http://link.springer.com/content/pdf/10.1007/BF00766231.pdf

Reference15 articles.

1. Armstrong LD, Christensen GN (1961) Effect of moisture changes on creep in wood. Nature 191:869–870

2. Gibson EJ (1965) Creep of wood: role of water and effect of changing moisture content. Nature 206:213–215

3. Hearman RFS, Paton JM (1964) Moisture content changes and creep of wood. For Prod J 14:357–359

4. Hisada T (1979) Creep and set behavior of wood relating to kiln drying. II. Effects of stress level on tensile creep of wood during drying (in Japanese). Mokuzai Gakkaishi 25:697–706

5. Mukudai J, Yata S (1986) Modeling and simulation of viscoelastic behavior (tensile strain) of wood under moisture content. Wood Sci Technol 21:49–63

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