Image-based identification of optical quality and functional properties in inkjet-printed electronics using machine learning

Author:

Polomoshnov MaximORCID,Reichert Klaus-Martin,Rettenberger Luca,Ungerer MartinORCID,Hernandez-Sosa GerardoORCID,Gengenbach UlrichORCID,Reischl MarkusORCID

Abstract

AbstractWe propose a novel image-analysis based machine-learning approach to the fully-automated identification of the optical quality, of functional properties, and of manufacturing parameters in the field of 2D inkjet-printed test structures of conductive traces. To this end, a customizable modular concept to simultaneously identify or predict dissimilar properties of printed functional structures based on images is described and examined. An application domain of the concept in the printing production process is outlined. To examine performance, we develop a dataset of over 5000 test structures containing images and physical characteristics, which are manufactured using commercially available materials. Functional test structures are fabricated via a single-nozzle vector-based inkjet-printing system and thermally sintered. Physical characterization of electrical conductance, image capturing, and evaluation of the optical quality of the test structures is done by an automatic in-house built measurement station. Conceptionally, the design of a convolutional neural network is described to identify the optical quality and physical characteristics based only on acquired images. A mathematical apparatus that allows assessment of the identification accuracy is developed and described. The impact of printing resolution, of emerging defects in the geometry of printed structures, and of image quality and color space on the identification accuracy is analyzed. Quality groups related to the printing resolution that affect identification accuracy are determined. Supplementarily, we introduce not yet reported classification of processes related to the fabrication of printed functional structures, adopted from the process analytical technology.

Funder

Helmholtz Association

Karlsruher Institut für Technologie (KIT)

Publisher

Springer Science and Business Media LLC

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Modular Platform for Automated Characterisation of Printed Structures, Devices and Circuits;2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP);2024-06-02

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