Publisher
Springer Science and Business Media LLC
Subject
Artificial Intelligence,Industrial and Manufacturing Engineering,Software
Reference26 articles.
1. Dini, J. W., & Snyder, D. D. (2010). Electrodeposition of copper. In M. Schlesinger & M. Paunovic (Eds.), Modern electroplating (5th ed., pp. 33–78). New York: Wiley.
2. Gabrielli, C., Moçotéguy, P., Perrot, H., Nieto-Sanz, D., & Zdunek, A. (2006). A model for copper deposition in the damascene process. Electrochimica Acta,51(8–9), 1462–1472.
3. Gabrielli, C., Moçotéguy, P., Perrot, H., Nieto-Sanz, D., & Zdunek, A. (2008). An investigation of copper interconnect deposition bath ageing by electrochemical impedance spectroscopy. Journal of Appled Electrochemistry,38(4), 457–468.
4. Gabrielli, C., Mocoteguy, P., Perrot, H., Zdunek, A., Bouard, P., & Haddix, M. (2004). Electrochemical Impedance spectroscopy investigation of bath aging in damascene process chemistries. Electrochemical and Solid-State Letters,7(3), C31.
5. Gabrielli, C., Mocoteguy, P., Perrot, H., Zdunek, A., & Nieto-Sanz, D. (2007). Influence of the anode on the degradation of the additives in the damascene process for copper deposition. Journal of the Electrochemical Society,154(3), D163.
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献