1. Fletcher, L.S., “Recent Developments in Contact Conductance Heat Transfer,” J. Heat. Transfer, Vol. 110,no. 1059(1988).
2. Lambert, M.A. and Fletcher, L.S., “A Review of Thermal Contact Conductance of Junctions with Metallic Coatings and Films,” AIAA Paper 92-0709, AIAA 30th Aerospace Meeting, Reno, NV (1992).
3. Phelan, P.E., Niemann, R.C., and Nicol, T.H., “Thermal Contact Resistance for a Cu/G-10 Interface in a Cylindrical Geometry,” A\SME Proceedings of the 31st National Heat Transfer. Converence, Vol. 5,no. 185 (1996).
4. Zhao, L., Phelan, P.E., Niemann, R.C. and Weber, B.R., “Thermal Resistance across a Copper/Kapton/Copper Interface at Cryogenic Temperatures,” submitted to the 1997 Cryogenic Engineering Conference, Portland, Oregon
5. Rule, D.L., Smith, D.R. and Sparks, L.L., “Thermal Conductivity of a Polyimide Film between 4.2 and 300K, with and without Alumina Particles as Filler,” NISTIR 3948, NIST (1995), p. 40.