Effect of interstitial compounds in controlling thermal contact conductance across pressed joints at cryogenic temperature and low contact pressure
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference33 articles.
1. Thermal Contact Conductance;Madhusudana,1996
2. Thermal contact resistance of different materials between 0.3 K and 4.5 K;Colin;Cryogenics,2008
3. Thermal conductance measurements of bolted copper to copper joints at sub-Kelvin temperatures;Didschuns;Cryogenics,2004
4. Thermal impedance of pressed contacts at temperatures below 4 K;Yoo;Cryogenics,1983
5. Thermal conductance of pressed metallic contacts augmented with indium foil or Apiezon grease at liquid helium temperatures;Salerno;Cryogenics,1994
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