System for Cooling of Electronic Components

Author:

Vasil’ev L. L.,Grakovich L. P.,Dragun L. A.,Zhuravlev A. S.,Olekhnovich V. A.,Rabetskii M. I.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,Condensed Matter Physics

Reference9 articles.

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3. I. V. Glukhikh, S. S. Polikarpov, S. V. Frolov, A. S. Volkov, and V. V. Privezentsev, Cooling of laser diode assemblies of the silver-bullet type, Zh. Tekh. Fiz., 80, Issue 7, 101–105 (2010).

4. E. Yakhshi-Tafti and H. Pearlman, Subcooled and saturated refrigerants in minichannel heat sinks, Proc. ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting and 12th Int. Conf. on Nanochannels, Microchannels, and Minichannels, August 3–7, 2014, Chicago, Illinois, USA (2014), pp. 139–148.

5. L. Anatychuk, L. Vichor, Yu. Rozver, B. Rassamakin, S. Khairnasov, and Yu. Nikolaenko, Research and development on performances of large-sized thermoelectric module with heat pipes, Int. J. Heat Pipe Sci. Technol., 2, No. 1, 1–11 (2014).

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