Electrocrystallization of copper in chloride aqueous solutions-Reference-Cited by-同舟云学术

Electrocrystallization of copper in chloride aqueous solutions

Published:1977-03 Issue:1 Volume:8 Page:315-321
ISSN:0360-2141
Container-title:Metallurgical Transactions B
language:en
Short-container-title:MTB

Author:

Andrianne P. A.,Dubois J. P.,Winand R. F. P.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02657662.pdf

Reference16 articles.

1. E. A. Ashcroft:Trans. Electrochem. Soc, 1933, vol. 63, p. 23.

2. S. D. Gokhale:J. Sci. Ind. Res., 1951, vol. 10B,p.316.

3. G. C. Mitter, B. K. Rose, S. G. Dighe, Y. W. Gokhale, and B. P. Choudhury:J. Sci. Ind. Res., 1961, vol. 20D, p. 114.

4. V. Aravamuthan and R. Srinivasan:J Sci. Ind. Res., 1962, vol. 21D, p. 381.

5. P. R. Kruesi: U.S. Patent 3,673,061, 1972.

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Non-uniform film growth and micro/macro-galvanic corrosion of copper in aqueous sulphide solutions containing chloride;Corrosion Science;2017-01

2. Copper Electrowinning from Ammonia Solution Containing Cu(I) with Emphasis on the Morphology of the Deposits;Resources Processing;2007

3. Electrolytic Copper Deposition from Ammoniacal Alkaline Solution Containing Cu(I);MATERIALS TRANSACTIONS;2006

4. Electrodeposition of copper from pure cupric chloride hydrochloric acid solutions;Journal of Applied Electrochemistry;1997

5. Electrodeposition of metals and alloys—new results and perspectives;Electrochimica Acta;1994-06