Thermomechanical behavior of underfill/solder mask/substrate interface under thermal cycling

Author:

Chien C. -H.,Chen Y. -C.,Hsieh C. -C.,Chiou Y. -T.,Wu Y. -D.,Chen T. -P.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Aerospace Engineering

Reference20 articles.

1. Suhir, E., “The Future of Microelectronics and Photonics and the Role of Mechanics and Materials,”ASME, Journal of Electronic Packaging,120,1–11 (1998).

2. Chong, T.O., Ong, S.H. and Yew, T.G., “Low Cost Flip Chip Package Design Concepts for High Density I/O,” IEEE Electronic Components and Technology Conference, Orlando, FL, USA, 1140–1143 (2001).

3. Tong, Q., Ma, B., Xiao, A., Savoca, A., Luo, S., and Wong, C.P., “Fundamental Adhesion Issues for Advanced Flip Chip Packages,” IEEE Electronic Components and Technology Conference, 1373–1379 (2002).

4. Bressers, H., Beris, P., Cacrs, J., and Wondegem, J., “Influence of Chemistry and Processing of Flip Chip Underfills on Reliability,” Proceedings of the 2nd International Conference on Adhesive Joining Coating Technology and Electronic Manufacturing, Sweden (1996).

5. Ume, I.C., Martin, C., andGatro, J.T., “Finite Element Analysis of PWB Warpage Due to the Solder Masking Process,”IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A,20,295–306 (1997).

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