Study of Interface Reliability of PCB-UF Interface in FCBGAs under Sustained High Temperature Operation in Automotive Underhood Environments-Reference-Cited by-同舟云学术

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Study of Interface Reliability of PCB-UF Interface in FCBGAs under Sustained High Temperature Operation in Automotive Underhood Environments

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Lall Pradeep¹,Choudhury Padmanava¹

Affiliation:

1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849

Funder

Semiconductor Research Corporation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899517.pdf?arnumber=9899517

Reference20 articles.

1. A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces

2. Development of a test method for measuring the mixed mode fracture resistance of bimaterial interfaces

3. Crack Paralleling an Interface Between Dissimilar Materials

4. Standard test methods for flexural Properties of unreinforced and reinforced plastics and electrical insulating materials;ASTM D,0

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal aging study of encapsulated power devices under autonomous driving condition and its effect on board level reliability;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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