Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering-Reference-Cited by-同舟云学术

Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering

Published:2002-06 Issue:6 Volume:31 Page:576-583
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lee Jong-Hyun,Kim Yong-Seog

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0128-1.pdf

Reference21 articles.

1. J. London and D.W. Ashall, Brazing Soldering 11, 49 (1986).

2. S. Bader, W. Gust, and H. Hieber, Acta Metall. Mater. 43, 329 (1995).

3. M. Schaefer, W. Laub, J.M. Sabee, and R.A. Fournelle, J. Electron. Mater. 25, 992 (1996).

4. M. Schaefer, W. Laub, R.A. Fournelle, and J. Liang, Design and Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw, and W.L. Winterbottom (Warrendale, PA: TMS, 1997).

5. S. Chada, W. Laub, R.A. Fournelle, and D. Shangguan, J. Electron. Mater. 28, 1194 (1999).

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