An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates-Reference-Cited by-同舟云学术

An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates

Published:1999-11 Issue:11 Volume:28 Page:1194-1202
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chada S.,Laub W.,Fournelle R. A.,Shangguan D.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-999-0157-0.pdf

Reference7 articles.

1. M. Schaefer, W. Laub, J.M. Sabee, and R.A. Fournelle, J. Electron. Mater. 25, 992 (1996).

2. M. Schaefer, W. Laub, R.A. Fournelle, and J. Liang, Design and Reliability of Solders and Solder Interconnects, ed. R.K. Mahidhara et al., (Warrendale, PA: TMS, 1997), p. 247.

3. D.A. Porter and K.E. Easterling, Phase Transformations in Metals and Alloys (Berkshire, England: Van Nostrand Reinhold, 1981), p. 213.

4. M. Schaefer, R.A. Fournelle, and J. Liang, J. Electron. Mater. 27, 1167 (1998).

5. J. London and D.W. Ashall, Brazing and Soldering 11, 49 (1986).

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