1. H.I. Hanafi, S. Tiwari, and I. Khan, IEEE Trans. Electron Dev. 43, 1553 (1996).
2. Y. King, T. King, and C. Hu, Tech. Dig., Int. Electron Dev. Meeting, 115 (1998).
3. Z. Liu, V. Narayanan, M. Kim, G. Pei, and E.C. Kan, Proc. 59th Device Research Conf. (Piscataway, NJ: IEEE, 2001), p. 79.
4. Y. Shi, K. Saito, H. Ishikuro, and T. Hiramoto, Jpn. J. Appl. Phys. 38, 425 (1999).
5. M.H. White, Y. Yang, A. Purwar, and M.L. French, IEEE Trans. Comp. Packag. Manuf. Technol. Part A (Piscataway, NJ: IEEE, 1997), pp. 190–195.