A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy-Reference-Cited by-同舟云学术

A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

Published:2003-06 Issue:6 Volume:32 Page:548-557
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Jeon Young-Doo,Nieland Sabine,Ostmann Andreas,Reichl Herbert,Paik Kyung-Wook

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0141-z.pdf

Reference6 articles.

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2. S.K. Kang et al., Proc. 51st Electron. Comp. and Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 448–454.

3. K. Zeng, V. Vuorinen, and J.K. Kivilahti, Proc. 51st Electron. Comp. Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 693–698.

4. K.Y. Lee, M. Li, D.R. Olsen, and W.T. Chen, Proc. 51st Electron. Comp. Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 478–485.

5. A. Zribi, L. Zavalij, P. Borgesen, A. Primavera, G. Westby, and E.J. Cotts, Proc. 51st Electron. Comp. Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 687–692.

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