Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition-Reference-Cited by-同舟云学术

Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

Published:2017-11-06 Issue:2 Volume:47 Page:988-993
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Wu Zijian,Cai Jian,Wang Junqiang,Geng Zhiting,Wang Qian

Funder

National Basic Program of China

National Natural Science Foundation of China (CN)

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s11664-017-5831-z/fulltext.html

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