Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders-Reference-Cited by-同舟云学术

Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders

Published:2007-12-08 Issue:3 Volume:37 Page:347-354
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen T.,Dutta I.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-007-0340-0.pdf

Reference44 articles.

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4. H.G. Song, J.W. Morris, F. Hua, Mater. Trans. 43, 184 (2002).

5. A. Schubert, H. Walter, R. Dudek, B. Michel, G. Lefranc, J.␣Otto, G. Mitic, Proceedings, 2001 International Symposium on Advanced Packaging Materials, 129 (2001).

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