Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate-Reference-Cited by-同舟云学术

Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate

Published:2004-12 Issue:12 Volume:33 Page:1497-1506
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Qi Y.,Zbrzezny A. R.,Agia M.,Lam R.,Ghorbani H. R.,Snugovsky P.,Perovic D. D.,Spelt J. K.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0091-0.pdf

Reference14 articles.

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3. A. Schubert, R. Dudek, H. Walter, E. Jung, A. Gollhardt, B. Michel, and H. Reichl, IEEE Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2002), pp. 1246–1255.

4. C. Kanchanomai, Y. Miyahita, and Y. Mutoh, J. Electron. Mater. 31, 151 (2002).

5. J.-Y. Park, C.-U. Kim, T. Carper, and W. Puligandla, J. Electron. Mater. 32, 1232 (2003).

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