1. R. Ciocci and M. Pecht, Solder. Surf. Mt. Tech. 18, 14 (2006).
2. M. Reid, J. Punch, M. Collins, and C. Ryan, Solder. Surf. Mt. Tech. 20, 3 (2008).
3. R. Coyle, M. Reid, J. Osenbach, C. Ryan, R.P.D. Fleming, R.␣Popowitch, H. McCormick, J. Punch, M. Collins, T.␣Koshmeider, J. Manock, S. Kummerl, and I. Chatterji, J.␣Electron. Mater. (2009).
4. O. Salmela, IEEE Trans. Compon. Packag. Technol. 30, 700 (2007).
5. A. Schubert, R. Dudek, E. Auerswald, A. Gollhardt, B. Michel, and H. Reichl, Elec. Comp. C. (2003), pp. 603–610.