Mechanism of fillet lifting in Sn-Bi alloys-Reference-Cited by-同舟云学术

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Mechanism of fillet lifting in Sn-Bi alloys

Published:2002-05 Issue:5 Volume:31 Page:545-550
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Boettinger W. J.,Handwerker C. A.,Newbury B.,Pan T. Y.,Nicholson J. M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0112-9.pdf

Reference8 articles.

1. J.H. Vincent and G. Humpston, GEC J. Res. 11, 76 (1994).

2. NCMS Report 0401RE96, Lead-Free Solder Project, National Center for Manufacturing Sciences, Ann Arbor, MI, Aug. 1997 (CD-ROM, June 1998).

3. K. Suganuma, Scripta Mater. 38, 1333 (1998).

4. H. Takao and H. Hasegawa, J. Electron. Mater. 30, 513 (2001).

5. J. Cambell, Castings (Oxford, United Kingdom: Butterworth-Heinmann, 1991), pp. 219–231.

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