1. iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints;Fu,2018
2. The application of Bi-based solders for low temperature reflow to reduce cost while improving SMT yields in client computing systems;Mokler,2016
3. Optimizing solder alloy composition for low temperature assembly;Sweatman,2019
4. The application of Bi-based solders for low temperature reflow to reduce cost while improving SMT yields in client computing systems;Mokler,2016