Enhanced Mechanical and Thermal Properties of Ag Joints Sintered by Spark Plasma Sintering-Reference-Cited by-同舟云学术

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Enhanced Mechanical and Thermal Properties of Ag Joints Sintered by Spark Plasma Sintering

Published:2022-08-23 Issue:11 Volume:51 Page:6310-6319
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Lu Xiuzhen^ORCID,Lv Zhen,Sun Yongqian,Murugesan Murali,Zhou Chenfei,Zhang Xiaoxin,Liu Johan

Funder

The National Natural Science Foundation of China

the Swedish Board for Strategic Research

the Swedish National Science Foundation

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-022-09849-4.pdf

Reference26 articles.

1. D. Shahzad, S. Pervaiz, N.A. Zaffar, and K.K. Afridi, GaN-Based High-Power-Density AC-DC-AC Converter for Single-Phase Transformerless Online Uninterruptible Power Supply. IEEE Trans. Power Electron. 36, 13968–13984 (2021).

2. T. Tominaga, T. Iwamatsu, Y. Nakao, H. Amishiro, H. Watanabe, S. Tomohisa, S, and Nakata, Body Potential Control Via P-Type Contact Resistance and its Influence on Switching Characteristics of 4H-SiC MOSFETs. IEEE Trans. Electron Devices 69, 285–290 (2022).

3. H. Yan, Y.H. Mei, C. Ma, and G.Q. Lu, A Multichip Phase-Leg IGBT Module Using Nanosilver Paste by Pressureless Sintering in Formic Acid Atmosphere. IEEE Trans. Electron Devices 65, 4499–4505 (2018).

4. M. Li, Y. Xiao, Z. Zhang, and J. Yu, Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications. ACS Appl. Mater. Interfaces 7, 9157–9168 (2015).

5. C. Chen and K. Suganuma, Large-Scale Ceramic-Metal Joining by Nano-Grained Ag Particles Paste Sintering in Low-Temperature Pressure-Less Conditions. Scr. Mater. 195, 113747 (2021).

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2. Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging;Micromachines;2024-08-28

3. Study on the reliability of nano-silver-coated tin solder joints for flip chips;Green Processing and Synthesis;2023-01-01

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