Electromigration failure in ultra-fine copper interconnects-Reference-Cited by-同舟云学术

Electromigration failure in ultra-fine copper interconnects

Published:2003-10 Issue:10 Volume:32 Page:988-993
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Michael Nancy L.,Kim Choong-Un,Gillespie Paul,Augur Rod

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0080-8.pdf

Reference14 articles.

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2. G. Steinlesberger, A. von Glasow, M. Engelhardt, G. Schindler, W. Honlein, M. Holz, and E. Bertagnolli, Proc. Int. Interconnect Technol. Conf. (Piscataway, NJ: IEEE, 2002), pp. 265–267.

3. L. Arnaud, G. Tartavel, T. Berger, D. Mariolle, Y. Gobil, and I. Touet, Microelectron. Reliab. 40, 77 (2000).

4. C.S. Hau-Riege and C.V. Thompson, Appl. Phys. Lett. 78, 3451 (2001).

5. L. Vanasupa, Y. Joo, P. Besser, and S. Pramanick, J. Appl. Phys. 85, 2583 (1999).

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