A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu-Reference-Cited by-同舟云学术

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A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu

Published:2008-10-16 Issue:1 Volume:38 Page:200-207
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Yan Li-ling,Lee Cheng-kuo,Yu Da-quan,Yu Ai-bin,Choi Won-Kyoung,Lau John-H,Yoon Seung-Uk

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-008-0561-x.pdf

Reference25 articles.

1. N. Miki. Sens Lett 3, 263 (2005) doi: 10.1166/sl.2005.039

2. S. Sommadossi, W. Gust, E.J. Mittemeijer. Mater. Chem. Phys. 77, 924–00 (2002) doi: 10.1016/S0254-0584(02)00192-X

3. P.T. Vianco, P.F. Hlava, A.C. Kilgo. J. Electron. Mater. 23, 583 (1994) doi: 10.1007/BF02653343

4. S.W. Chen, S.K. Lin, C.F. Yang, J. Electron. Mater. 35, 72 (2006) doi: 10.1007/s11664-006-0186-x

5. T.H. Chuang, H.J. Lin, C.W. Tsao. J. Electron. Mater. 35, 1566 (2006) doi: 10.1007/s11664-006-0150-9

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