Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters-Reference-Cited by-同舟云学术

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Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters

Published:2013-04-04 Issue:6 Volume:42 Page:1171-1183
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hokka Jussi,Mattila Toni. T.,Xu Hongbo,Paulasto-Kröckel Mervi

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-013-2551-x.pdf

Reference26 articles.

1. IPC SM-785. Guidelines for accelerated reliability testing of surface mount solder attachments (1992).

2. J.W.C. de Vries, M.Y. Jansen, and W.D. van Driel, Microelectron. Reliab. 47, 444 (2007).

3. JEDEC Standard JESD22-A104C, Temperature cycling (May 2005).

4. JEDEC Standard JESD22-A106B, Temperature shock (June 2004).

5. IEC International Standard 60068-2-14 ed 6.0, Environmental testing. Part 2-14: Tests. Test N: Change of temperature (2009).

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