Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests-Reference-Cited by-同舟云学术

Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests

Published:2001-09 Issue:9 Volume:30 Page:1214-1221
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Cook B. A.,Anderson I. E.,Harringa J. L.,Terpstra R. L.,Foley J. C.,Ünal Ö.,Laabs F. C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0152-6.pdf

Reference19 articles.

1. J. Bath, C. Handweker, and E. Bradley, Circuits Assembly (2000), p. 31.

2. C.M. Miller, I.E. Anderson, and J.F. Smith, J. Electron. Mater. 23, 595 (1994).

3. I.E. Anderson, T.E. Bloomer, R.L. Terpstra, J.C. Foley, B.A. Cook, and J.L. Harringa, Proc. Int. Brazing and Soldering Conf. 2000 (Miami, FL: Amer. Welding Soc., 2000), p. 575.

4. I.E. Anderson, NEPCON West (Norwalk, CT: Reed Exhibition Co., 1996), p. 882.

5. S. Jin, JOM 45, 13 (1993).

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