Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging-Reference-Cited by-同舟云学术

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Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

Published:2014-01-31 Issue:4 Volume:43 Page:1017-1025
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Gan C. L.,Classe F. C.,Chan B. L.,Hashim U.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-014-3011-y.pdf

Reference34 articles.

1. G.G. Harman, Wirebonding in Microelectronic: Materials, Processes, Reliability and Yield, 2nd ed. (New York: McGraw Hill, 1999), pp. 135–155.

2. C.D. Breach, Gold Bull. 43, 150 (2010).

3. C.L. Gan, E.K. Ng, B.L. Chan, and U. Hashim, Proceedings of IEEE Impact, (Taipei, 2012), pp. 18–21.

4. C.L. Gan, T.T. Toong, C.P. Lim, and C.Y. Ng, Proceedings of 34th IEEE CPMT IEMT, (Malacca, 2010), p. 1.

5. C.W. Tan and A.R. Daud, J. Mater. Eng. Perform. 11, 283 (2002).

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1. Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review;Journal of Materials Science: Materials in Electronics;2023-10

2. Copper Wire Bonding: A Review;Micromachines;2023-08-16

3. Review of the Failure Mechanism and Methodologies of IGBT Bonding Wire;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-07

4. Wearout Reliability-Based Characterization in Memory Packaging;Springer Series in Reliability Engineering;2023

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