1. K. Zeng and K.N. Tu, Mater. Sci. Eng., R38, 55 (2002)
2. J.H. Lau, C.P. Wong, N.C. Lee, S.W.R. Lee, Electronics Manufacturing with Lead-free, Halogen-free & Conductive-adhesive Materials, (New York: McGraw-Hill, 2003), pp. 1.1–1.22
3. J.H. Lau, Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, (New York: McGraw-Hill, 2003), pp. 95–120
4. X. Deng, R.S. Sidhu, P. Johnson, and N. Chawla, Metall. Mater. Trans. A 36A, 55 (2005)
5. X. Deng, G. Piotrowski, J.J. Williams, and N. Chawla, J. Electron. Mater. 32, 1403 (2003)