Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-Plated kovar-Reference-Cited by-同舟云学术

Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-Plated kovar

Published:2003-04 Issue:4 Volume:32 Page:254-260
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lopez Edwin P.,Vianco Paul T.,Rejent Jerome A.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0218-8.pdf

Reference4 articles.

1. B. Richards, An Analysis of the Current Status of Lead-Free—Update 2000 (Uxbridge, UK: Middlesex Centre for Materials and Measurement Technology, 2000).

2. Kovar is a registered trademark of Carpenter Technologies, Reading, PA.

3. P. Vianco, Solder. Surf. Mt. Technol. 24, 12 (1996).

4. R.J. Klein Wassink, Soldering in Electronics (Ayr, Scotland: Electrochemical Publications Limited, 1984), p. 235.

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