Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics-Reference-Cited by-同舟云学术

Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics

Published:2018-04-26 Issue:7 Volume:47 Page:4190-4207
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Piotrowska Kamila^ORCID,Ud Din Rameez,Grumsen Flemming Bjerg,Jellesen Morten Stendahl,Ambat Rajan

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s11664-018-6311-9/fulltext.html

Reference80 articles.

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2. C.J. Tautscher, Contamination Effects on Electronic Products (New York: CRC Press, 1991).

3. M. Nasta and H.C. Peebles, Circuit World 21, 4 (1995).

4. J.F. Shipley, Weld. J. 54, 10 (1975).

5. R. Ambat, M.S. Jellesen, D. Minzari, U. Rathinavelu, M.A.K. Johnsen, P. Westermann, and P. Møller, in Proceedings of the European Corrosion Congress EUROCORR (2009), paper no. 81s1.

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