Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics

Author:

Piotrowska KamilaORCID,Ud Din Rameez,Grumsen Flemming Bjerg,Jellesen Morten Stendahl,Ambat Rajan

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference80 articles.

1. H.H. Manko, Solders and Soldering. Materials, Design, Production, and Analysis for Reliable Bonding, 2nd ed. (New York: McGraw-Hill, 1979).

2. C.J. Tautscher, Contamination Effects on Electronic Products (New York: CRC Press, 1991).

3. M. Nasta and H.C. Peebles, Circuit World 21, 4 (1995).

4. J.F. Shipley, Weld. J. 54, 10 (1975).

5. R. Ambat, M.S. Jellesen, D. Minzari, U. Rathinavelu, M.A.K. Johnsen, P. Westermann, and P. Møller, in Proceedings of the European Corrosion Congress EUROCORR (2009), paper no. 81s1.

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