1. D.P. Tracy and E.J. Vardaman, Global Semiconductor Packaging Materials Outlook (Austin, TX: SEMI and TechSearch International, 2007)
2. T.Y. Lin, W.S. Leong, K.H. Chua, R. Oh, Y. Miao, J.S. Pan, and J.W. Chai, Microelectron. Reliab. 42, 375 (2002).
3. S.J. Cho, K.W. Paik, and Y.G. Kim, IEEE Trans. Compon. Packag. Manuf. Technol. B 20, 167 (1997).
4. H.Y. Lee and G.S. Park, J. Mater. Sci. 37, 4247 (2002).
5. J.T. Huneke and M. Cowens, Electronic Packaging Technology Conference, 1997. Proceedings of the 1st 1997, (1997), p. 208