Real-time scanning electron microscopy and auger spectroscopy of wetting in Sn-3.3Ag-4.8Bi solder paste wetted to Ni-Au-Reference-Cited by-同舟云学术

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Real-time scanning electron microscopy and auger spectroscopy of wetting in Sn-3.3Ag-4.8Bi solder paste wetted to Ni-Au

Published:2005-03 Issue:3 Volume:34 Page:248-265
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Bozack M. J.,Johnson R. W.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-005-0211-5.pdf

Reference32 articles.

1. S.V. Sattiraju, B. Dang, R.W. Johnson, Y. Li, J.S. Smith, and M.J. Bozack, IEEE Trans. Electron. Packaging Manufacturing 25, 168 (2002).

2. J.S. Hwang, Environment-Friendly Electronics: Lead-Free Technology (Electrochemical Publications Ltd., Isle of Man, British Isles, 2001), p. 224.

3. J.S. Hwang, Environment-Friendly Electronics: Lead-Free Technology (Electrochemical Publications Ltd., Isle of Man, British Isles, 2001), p. 225.

4. N. Lee, Chip Scale Rev., p. 42 (2000).

5. Lead-Free Solder Project Final Report, NCMS Report No. 170502, National Center for Manufacturing Sciences, Ann Arbor, MI, 1997.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microchemical Characterization of Natural Gold and Copper Alloys from the Ancient Um Shashoba Gold Mine, South Egypt;Acta Geologica Sinica - English Edition;2014-02

2. Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects;Journal of Materials Science: Materials in Electronics;2006-03

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