Three-dimensional analysis of the interface between an Sn-8wt.%Zn-3wt.%Bi solder and a substrate by using an angle-lapping method-Reference-Cited by-同舟云学术

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Three-dimensional analysis of the interface between an Sn-8wt.%Zn-3wt.%Bi solder and a substrate by using an angle-lapping method

Published:2006-07 Issue:7 Volume:35 Page:1537-1542
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Ishikawa Nobuhiro,Kimura Takashi,Nishida Kenji,Aoyagi Takeshi,Furuya Kazuo,Sugizaki Takashi

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-006-0145-6.pdf

Reference13 articles.

1. S. Sakami and K. Noda, J. Jpn. Inst. Electron. Packag. 2, 236 (1999).

2. P.T. Vianco and D.D. Frear, J. Miner. Metals Mater. Soc. 45, 14 (1993).

3. M. McCormack and S. Jin, J. Miner. Metals Mater. Soc. 45, 36 (1993).

4. K. Zeng and K.N. Tu, Mater. Sci. Eng. R38, 55 (2002).

5. For example: Kinzoku 73, 620 (2003).

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