Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates-Reference-Cited by-同舟云学术

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Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates

Published:2016-10-21 Issue:12 Volume:45 Page:6079-6085
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Liu C. Y.,Wei Y. S.,Lin E. J.,Hsu Y. C.,Tang Y. K.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-016-4941-3.pdf

Reference19 articles.

1. R. Ramanauskas, A. Selskis, J. Juodkazyte, and V. Jasulaitiene, Circuit World 39, 3 (2013).

2. W. Li, 16th International Conference on Electronic Packaging Technology (2015), pp. 538–541.

3. W.H. Wu, C.S. Lin, S.H. Huang, and C.E. Ho, J. Electron. Mater. 39, 11 (2010).

4. S.S. Ha, J. Park, and S.B. Jung, Mater. Trans. 52, 8 (2011).

5. Y. Oda, M. Kiso, S. Kurosaka, A. Okada, K. Kitajima, S. Hashimoto, G. Milad, and D. Gudeczauskas, 41st International Symposium Microelectronics (Providence, RI, Nov 2–6, 2008).

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