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2. K.L. Lin, W.L. Chen, J.C. Ho, H.K. Chow, and C.T. Tu (Paper presented at the Adv. Electron. Assembly Symp. on Pb-Free Interconnect, Boston, MA, 13–14 June 2000).
3. J.H. Lau, Flip Chip Technologies, ed. J.H. Lau (New York: McGraw-Hill, 1996), ch. 1.
4. L.S. Goldmann and P.A. Totta, Chip on Board Technologies for Multichip Modules, ed. J.H. Lau (New York: Van Nostrand Reinhold, 1994), ch. 5.
5. M. Pecht, Integrated Circuit Hybrid, and Multichip Module Package Design Guidelines (New York: John Wiley & Sons, 1994), ch. 7.