Characterization of nonconductive adhesives for flip-chip interconnection-Reference-Cited by-同舟云学术

Characterization of nonconductive adhesives for flip-chip interconnection

Published:2004-04 Issue:4 Volume:33 Page:271-276
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Teh Lay Kuan,Wong Chee Cheong,Mhaisalkar Subodh,Ong Kristine,Teo Poi Siong,Wong Ee Hua

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0132-8.pdf

Reference11 articles.

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3. H. Kristiansen and J. Liu, IEEE Trans. Comp. Packaging Manufacturing Technol. Part A 21, 208 (1998).

4. R. Nagle, F. Stam, and J. Barrett, Int. J. Microelectron. Packaging Mater. Technol. 1, 187 (1998).

5. J. Crank, The Mathematics of Diffusion (Oxford, UK: Clarendon Press, 1956), pp. 149–161.

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