Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints-Reference-Cited by-同舟云学术

Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints

Published:2009-07-01 Issue:12 Volume:38 Page:
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lee Tae-Kyu,Liu Kuo-Chuan,Bieler Thomas R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-009-0873-5.pdf

Reference12 articles.

1. D. Frear, H. Morgan, and J.H. Lau, eds., The Mechanics of␣Solder Alloy Interconnects (New York: Van Nostrand Reinhold, 1994).

2. J.A. Rayne and B.S. Chandrasekhar, Phys. Rev. 120, 1658 (1960).

3. B. Zhou, T.R. Bieler, A.U. Telang, T.-k. Lee, and K.-C. Liu, J. Electron. Mater., this volume (2009).

4. T.R. Bieler, H. Jiang, L.P. Lehman, T. Kirkpatrick, and E.J. Cotts, 2006 Proceedings. 56th Electronic Components & Technology Conference (IEEE Cat. No. 06CH37766C) (2006), p. 6.

5. P. Borgesen, T. Bieler, L.P. Lehman, and E.J. Cotts, MRS Bull. 32, 360 (2007).

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