Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates-Reference-Cited by-同舟云学术

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Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates

Published:2007-09-22 Issue:1 Volume:37 Page:84-89
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Kang Han-Byul,Bae Jee-Hwan,Lee Jae-Wook,Park Min-Ho,Yoon Jeong-Won,Jung Seung-Boo,Yang Cheol-Woong

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-007-0262-x.pdf

Reference24 articles.

1. K. Zeng and K.N. Tu, Mater. Sci. Eng. R. 38, 55 (2002).

2. M. Abtew and G. Selvaduray, Mater. Sci. Eng. R. 27, 95 (2000).

3. J.W. Yoon, S.W. Kim, and S.B. Jung, Mater. Trans. 45, 727 (2004).

4. K. Suganuma, Curr. Opin. Solid State Mater. Sci. 5, 55 (2001).

5. J.W. Yoon, S.W. Kim, J.M. Koo, D.G. Kim, and S.B. Jung, J. Electron. Mater. 33, 1190 (2004).

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1. Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders;Applied Surface Science;2023-07

2. Mechanisms and solutions to the brittle solder joint in electroless Ni plating;Microelectronics Reliability;2016-10

3. Formation of octahedral corrosion products in Sn–Ag flip chip solder bump;Scripta Materialia;2015-11

4. Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints;Journal of Alloys and Compounds;2015-04

5. Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions;Journal of Materials Science: Materials in Electronics;2014-12-18

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