Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid–Liquid Interdiffusion (SLID) Bonding

Author:

Rodriguez Rogie I.,Ibitayo Dimeji,Quintero Pedro O.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference17 articles.

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2. P.O. Quintero, T. Oberc, and P. McCluskey, 58th Electronic Components and Technology Conference (2008).

3. R.W. Johnson, J.L. Evans, P. Jacobsen, J.R.R. Thompson, and M. Christopher (2004). doi: 10.1109/TEPM.2004.843109 .

4. P. Zheng, A. Wiigins, W. Johnson, R.V. Frampton, and S.J. Adam, HITEC 2008 (2008).

5. G. Sharma and V. Kripesh, 8th Electronics Packaging Technology Conference (2006).

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