Transient Liquid-Phase Sintering Bonding Based on Cu40Sn60 (wt.%) Core/Shell Particles for High-Temperature Power Device Packaging-Reference-Cited by-同舟云学术

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Transient Liquid-Phase Sintering Bonding Based on Cu40Sn60 (wt.%) Core/Shell Particles for High-Temperature Power Device Packaging

Published:2021-10-13 Issue:12 Volume:50 Page:7283-7292
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Peng Xianwen,Wang Yue,Ye Zheng,Huang Jihua^ORCID,Yang Jian,Chen Shuhai,Zhao Xingke

Funder

the National Nature Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-021-09257-0.pdf

Reference24 articles.

1. X. She, A.Q. Huang, O. Lucia, and B. Ozpineci, Review of silicon carbide power devices and their applications IEEE Trans. Ind. Electron. 64, 8193 (2017).

2. J.P. Viricelle, P. Breuil, C. Pijolat, J.C. Marchand, G. Tournier, Comparison of the performances of ß-alumina and YSZ potentiometric gas sensors for exhaust automotive application. in SENSORS, 2007 IEEE (2007), p. 1318

3. R.W. Johnson, J.L. Evans, P. Jacobsen, J.R. Thompson, and M. Christopher, The changing automotive environment: high-temperature electronics IEEE Trans. Electron. Packag. Manuf. 27, 164 (2004).

4. V. Balakrishnan, H.P. Phan, T. Dinh, D.V. Dao, and N.T. Nguyen, Thermal flow sensors for harsh environments Sensors 17, 2061 (2017).

5. D. Singh, Venus nightside surface temperature Sci. Rep. 9, 1137 (2019).

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