Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies-Reference-Cited by-同舟云学术

Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies

Published:2019-08-23 Issue:11 Volume:48 Page:7573-7584
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Kutilainen Terho,Pudas Marko,Ashworth Mark A.^ORCID,Lehto Tero,Wu Liang,Wilcox Geoffrey D.,Wang Jing,Collander Paul,Hokka Jussi

Funder

European Space Agency

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-019-07534-7.pdf

Reference36 articles.

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2. M. Osterman, in 6th International Symposium Tin Whiskers (Henry Ford College, Loughborough, UK, 2012).

3. J. A. Brusse, G. J. Ewell, and J. P. Siplon, in Cart. 2002 22nd Capacitor and Resistor Technology Symposium 25–29 March 2002 (New Orleans, Louisiana, 2002), p. 67.

4. E. Chason, N. Jadhav, F. Pei, E. Buchovecky, and A. Bower, Prog. Surf. Sci. 88, 103 (2013).

5. B. Illés, A. Skwarek, J. Ratajczak, K. Dušek, and D. Bušek, J. Alloys Compd. 785, 774 (2019).

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