Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application-Reference-Cited by-同舟云学术

Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application

Published:2014-04-08 Issue:7 Volume:43 Page:2498-2509
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chidambaram Vivek,Bangtao Chen,Lip Gan Chee,Rhee Min Woo Daniel

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-014-3131-4.pdf

Reference19 articles.

1. J. Watson, High-temperature electronics pose design and reliability challenges (Analog Dialogue, April 2012), http://www.analog.com/library/analogDialogue/ . Accessed 15 July 2013.

2. V. Chidambaram, H.B. Yeung, and G. Shan, J. Electron. Mater. 41, 8 (2012).

3. S.-H. Choa, J. Microsyst. Technol. (2005). doi: 10.1007/s00542-005-0603-8 .

4. W.C. Welch III and K. Najafi, Proceedings of the International Conference on MEMS (Tucson, United States, 2008), p. 806.

5. W. Zhang, A. Matin, E. Beyne, and W. Ruythooren, Proceedings of the Electronic Components and Technology Conference (Singapore, 2008), p. 1984.

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