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Strength of Soldered Joints Formed under Microgravity Conditions

  • Published:2007-01-04 Issue:1 Volume:36 Page:1-5
  • ISSN:0361-5235
  • Container-title:Journal of Electronic Materials
  • language:en
  • Short-container-title:Journal of Elec Materi

Author:

Thomas B.,Atkinson A.,Dashwood R. J.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. European Parliament, Directives 2002/95/EC and 2002/96/EC on Waste Electrical and Electronic Equipment (WEEE), 2003

2. N.C. Lee, Lead-Free Soldering—Where the World is Going (Indium Corporation of America)

3. B. Huang and N.C. Lee, Prospect of Lead Free Alternatives for Reflow Soldering (Indium Corporation of America)

4. K. Saganuma, Curr. Opin. Solid State Mater. Sci. 5, 55 (2001)

5. Parabolic Flight Campaign with A300-G, User’s Manual (France: Novespace)

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3. Magnetic solder to reduce porosity of solder joints formed in microgravity;Acta Astronautica;2021-01

4. Environmental assessment of Norwegian priority pharmaceuticals based on the EMEA guideline;Ecotoxicology and Environmental Safety;2008-10
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