Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder Joints-Reference-Cited by-同舟云学术

Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder Joints

Published:2010-04-02 Issue:8 Volume:39 Page:1295-1297
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Belyakov S.,Atkinson H. V.,Gill S. P. A.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-010-1184-6.pdf

Reference11 articles.

1. S.K. Kang, P.A. Lauro, D.Y. Shih, D.W. Henderson, and K.J. Puttlitz, IBM J. Res. Dev. 49, 607 (2005).

2. D.P. Cullen, Avoiding Microvoids, Assembly (on-line magazine), September 2005. http://www.assemblymag.com/CDA/Archives/56840a86f06c9010VgnVCM100000f932a8c0 .

3. M. Wickham, M. Dusek, L. Zou, and C. Hunt, Effect of Voiding on Lead-Free Reliability, NPL Report DECP MPR 033, National Physical Laboratory, Teddington, UK, April 2005.

4. Handbook and Guide to IPC-610, Rev. D, Acceptability of Electronic Assemblies (Northbrook: IPC, 2005).

5. R.F. Aspandiar, Surf. Mt. Technol. J. 19, 4 (2006).

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