Study of Flux/E-GaIn Interfacial Tension and Wetting Behavior of Fluxes-Reference-Cited by-同舟云学术

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Study of Flux/E-GaIn Interfacial Tension and Wetting Behavior of Fluxes

Published:2022-10-26 Issue:1 Volume:52 Page:293-303
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Sui Ran,Chang Jinghuan,Cao Rui,Lin Qiaoli

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-022-09989-7.pdf

Reference23 articles.

1. G. Humpston and D.M. Jacobson, Principles of Soldering (Materials Park: ASM International, 2004).

2. W.F. Gale and T.C. Totemeier, Smithells Metals Reference Book (Amsterdam: Elsevier, 2003).

3. S.-Y. Tang, K. Khoshmanesh, V. Sivan, P. Petersen, A.P.O. Mullane, D. Abbotte, A. Mitchell, and K. Kalantar-zadeh, Liquid Metal Enabled Pump. Proc. Natl. Acad. Sci. U.S.A. 111, 3304 (2014).

4. L. Sheng, J. Zhang, and J. Liu, Diverse Transformations of Liquid Metals Between Different Morphologies. Adv. Mater. 26, 6036 (2014).

5. F.H. Howie and E.D. Hondros, The Surface Tension of Tin-Lead Alloys in Contact with Fluxes. J. Mater. Sci. 17, 1434 (1982).

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