Principles of Soldering

Abstract

Principles of Soldering serves as a problem-solving guide for engineers who work with soldering processes and soldered components and assemblies. It begins with a review of key process parameters, including surface energy and tension, wetting and contact angle, fluid flow, filler spreading characteristics, dissolution of parent materials, and intermetallic growth. It then examines the factors that influence the functional integrity of soldered joints and the practicality of the process employed. It discusses the metallurgy of solder alloy systems, the effect of metallic impurities, and the use of phase diagrams to better understand and control the soldering process. It explains how joining atmospheres influence chemical reactions and how fluxes help remove surface oxides and other films. It describes the benefits of fluxless soldering and the role of materials in defining process constraints. It also covers lead-free solders, bump bonding, amalgams, and diffusion soldering as well as mechanical property testing, joint characterization and modeling techniques, and solderability standards. For information on the print version, ISBN 978-0-87170-792-5, follow this link.