Author:
Wang Shoukai,Pang Dick S.,Chung D.D.L.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. K.N. Tu, Mater. Chem. Phys. 46, 217 (1996)
2. K. Tsutsumi, M. Kohara, H. Shibata, H. Nakata, Int. J. Hybrid Microelectron. 7, 38 (1984)
3. K.D. Kim, D.D.L. Chung, J. Electron. Mater. 31, 933 (2002)
4. T. Inada and C.P. Wong, Proc. Int. Symp. Adv. Packaging Materials: Processes, Properties and Interfaces, 4th ed. (1998)
5. C.-K. Leong, D.D.L. Chung, J. Electron. Mater. 33, 203 (2004)
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