Author:
Kim Kyu Dong,Chung D. D. L.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Sung K. Kang and S. Purushothaman, J. Electron. Mater. 28 (11), 1314 (1999).
2. Daoqiang Lu, Quinn K. Tong, and C.P. Wong, IEEE Trans. Electron. Packag. Manufact. 22 (3), 223 (1999).
3. Teiichi Inada and C.P. Wong, Proc. 1998 4th Int. Symp. on Advanced Packaging Materials: Processes, Properties and Interfaces (Piscataway, NJ: IEEE, 1998), pp. 268–271.
4. T.W. Giants, J. Adh. Sci. Technol. 12 (6), 593 (1998).
5. Klaus Feldmann and Ralf Luchs, Surf. Mount. Technol. 12 (5), 74, 76, 78 (1998).
Cited by
28 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献